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                                                              PCB流程四
                                                              2014-12-24 11:04:58

                                                              采用鹵素燈為光源,再配合光纖呈多方向照射,利用反射光和散射光來攝取影像后與原始資料對比進行缺點判定
                                                              Use halogen lamp as alluminant and shine in every directions.Get image data by reflected light and scattered light, and compare with initial data to judge the defect.

                                                              去除銅面氧化物、雜質及油脂,清潔板面、粗化板面,增強防焊油墨與板面結合力與附著力
                                                              Remove the oxide、impurity and grease on the surface of PCB, then clean and coarsen the surface to add adhension between solder mask and surface.

                                                              利用刮刀,借用一定的角度與壓力推擠油墨,透過網版上網紗的縫隙,在板面上均勻的覆蓋一層防焊油墨.
                                                              Push solder mask on the halftone with scrapers and coat the ink on the surface of the board through gaps on the halftones.

                                                              使印刷后防焊油墨內有機溶劑揮發,油墨初步固化, 以便于后續曝光制程作業
                                                              Cure the solder mask with PCB by evaporating organic solvent to ensure follow-up exposure.

                                                              利用紫外線的能量,讓感光油墨中的光敏物質進行光化學反應,將底片上圖像轉移至板面上
                                                              Use the energy of UV light to transfer the image from film to surface of PCB by photochemical reaction.

                                                              通過顯影機將Na2CO3溶液噴灑在板面,利用藥水和油墨之化學反應,將板面未發生光聚合反應的油墨沖洗掉.
                                                              Put sodium carbonate on the surface of boards by developer to remove the solder mask without photochemistry by chemical reaction between solution and solder mask .

                                                              利用溫度、時間等參數讓油墨內的有機溶劑揮發,使油墨完全硬化。
                                                              Cure solder mask completely by evaporating the organic solvent with suitable temperature and time.

                                                              利用刮刀,借用一定的角度與壓力推擠油墨﹐透過網版上網紗的縫隙,在板面上印刷出相應的文字或字符
                                                              Push silk screen on the halftone with scrapers and coat the characters on the surface of the board through gaps on the halftones.

                                                              根據文字油墨的特性,通過UV光或熱風烘烤的方式對其進行固化。
                                                              Cure the ink on the board completely by UV light or baking according to speciality of printing ink.

                                                              將板面外框切掉或進行板內局部挖空機械作業以符合客戶之外型尺寸要求
                                                              Cut out panel profile,or shave part of board to meet the dimension requirment of customer

                                                              針對多個單元板連片出貨設計之板,在各單元連接刻出V型凹槽,以利組裝完成后各單元拆分作業;
                                                              Make a V-shape groove in the middle of  two or above units for breaking on back-end process process.

                                                              去除板面氧化以及成型與V-CUT后殘留粉塵
                                                              Remove surface oxidation and  dust   after the Routing&v-cut

                                                               

                                                               

                                                               
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